3D Printing Semiconductor Heating Plate

Product 3D Printing Semiconductor Heating Plate Introduction FLK3D printing technology prepared silicon carbide ceramic heating plate, mainly used in semiconductor wafer heating device through special structural design to improve the heating efficiency and heating uniformity of the wafer, the product manufacturing cycle time, high thermal stability, long service life, while meeting the customer's design needs for different sizes and shapes. 3D printed silicon carbide ceramics  ● Complex structure with ultra-lightweight, topology design ●Short production cycle and fast delivery ●No need to open molds, reducing costs and high utilization of raw materials ●Large one-piece molding diameter up to 235m FAQ What is the range of your 3d printing applications? Our 3D printing  products are applied in Mining and Powder, Photovoltaic Field, Semiconductor Field, Microchemical Field and Energy & Power…

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